Exploring multi-standard front-ends by switching RF building blocks inside an innovative low-IF receiver. We are also investigating RF platforms, requiring adaptability inside RF building blocks. Aside system on a chip (SoC) aspects, multi-carrier technologies and passive integration for SiPs (System in Packages) are investigated.
Highly efficient switching power amplifiers (PAs) in combination with new linearization systems to cover non-constant envelope signals (for 3rd and 4th generation telecom systems.
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